WESEMiBAY is a highly influential, full-industry-chain professional exhibition dedicated to the Greater Bay Area’s semiconductor sector. It focuses on core domains such as wafer fabrication, advanced packaging, third-generation semiconductors, and IC design, bringing together leading domestic companies and technical experts from packaging & testing, materials, and equipment sectors. As a vital platform for innovation validation of domestic semiconductor materials and supply chain collaboration, the expo provided an ideal venue for Ruikeda to present its latest-generation ETFE semiconductor molding release film—developed to directly address persistent pain points in advanced packaging material performance.

This newly launched ETFE semiconductor molding release film leverages Ruikeda’s extensive expertise in fluoropolymer formulation and precision film manufacturing accumulated over years of R&D. It delivers key performance advantages, including exceptional thermal stability, ultra-low extractables, consistent and controllable release force, minimal thermal shrinkage, and outstanding resistance to epoxy resin wetting. Fully compatible with EMC transfer-molding processes, the film effectively mitigates common production challenges such as resin adhesion to molds, mold-release marks, and particulate contamination. Moreover, it meets stringent cleanliness requirements for advanced packaging technologies—including FOWLP, chiplet integration, and power devices—and passes rigorous reliability tests such as Pressure Cooker Test (PCT) and 85°C/85% RH (dual-85) conditions. By enabling higher yields and reduced process waste, the film supports packaging & testing manufacturers in enhancing operational efficiency and product quality.