The 2026 Greater Bay Area Semiconductor Industry Ecosystem Expo (WESEMiBAY) was held in Shenzhen. Qingdao Ruikeda New Materials Co., Ltd. participated in the exhibition with its independently developed high-end fluoropolymer film product portfolio, spotlighting its next-generation ETFE-based semiconductor molding release film. This innovative film is specifically engineered for advanced packaging processes—including EMC molding, fan-out wafer-level packaging (FOWLP), and Chiplet integration—and features exceptional thermal stability, ultra-low extractables, consistent release force, and minimal dimensional shrinkage. During the exhibition, Ruikeda’s technical team engaged in in-depth technical discussions with customers across the packaging and testing value chain, advancing domestic qualification of fluoropolymer release films and fostering collaborative optimization across the supply chain.

Held from September 16–18, 2026, the three-day 2026 World Solar & Energy Storage Industry Expo concluded successfully. Led by the General Manager of Qingdao Rekeda New Materials Technology Co., Ltd., our technical team delivered on-site professional consultation. We presented our core product, ultra-high water-barrier flexible perovskite PV encapsulation film, and jointly explored industrialization routes for flexible perovskite with industry partners.

ETFE molding film (Ethylene-Tetrafluoroethylene Copolymer Film) is a high-performance fluorine-based release material specially developed for high-temperature injection molding packaging of semiconductor chips.

ETFE release films are mainly applied to high-temperature packaging processes, including semiconductor EMC epoxy transfer molding, Fan-out packaging